F-01 is a single-crystal aluminum nitride thermal filler powder with a D50 of approximately 1μm. As a single-crystal product, F-01 offers higher purity and fewer grain boundary defects, making it particularly suitable for thermal management applications that demand stringent material quality and reliability. With its combination of high thermal conductivity and electrical insulation, it serves as an AlN high thermal conductivity insulating filler for advanced electronic systems.
In particle size distribution design for composite materials, the 1μm fine powder plays a key role in "filling the gaps between coarse particles." When combined with larger particle size fillers, it effectively increases packing density and particle-to-particle contact points, thereby further enhancing the overall thermal conductivity of the composite.
F-01, as a 1μm Single-crystal aluminum nitride thermal filler powder, is ideal for TIM applications that demand high thermal conductivity and stable quality. As an AlN semiconductor packaging filler, it delivers superior packing efficiency and thermal performance for advanced electronic packaging. When used in combination with coarse powders, it provides excellent filling efficiency and thermal conductivity, making it an essential fine powder component in precision particle size distribution formulations.
Item No :
F-01Size :
1umOrder(MOQ) :
1KGProduct Origin :
CHINAColor :
Gray-white
Performance Indicators
|
Diam(μm) |
Diff(%) |
Cum(%) |
Diam(μm) |
Diff(%) |
Cum(%) |
Diam(μm) |
Diff(%) |
Cum(%) |
|
0.020 |
|
|
1.324 |
14.87 |
42.76 |
90.658 |
0.00 |
100.00 |
|
0.024 |
0.00 |
0.00 |
1.674 |
17.60 |
60.36 |
114.653 |
0.00 |
100.00 |
|
0.031 |
0.00 |
0.00 |
2.117 |
17.13 |
77.49 |
144.999 |
0.00 |
100.00 |
|
0.039 |
0.00 |
0.00 |
2.677 |
13.11 |
90.60 |
183.377 |
0.00 |
100.00 |
|
0.049 |
0.00 |
0.00 |
3.386 |
6.98 |
97.58 |
231.913 |
0.00 |
100.00 |
|
0.063 |
0.00 |
0.00 |
4.282 |
2.14 |
99.72 |
293.295 |
0.00 |
100.00 |
|
0.079 |
0.00 |
0.00 |
5.416 |
0.28 |
100.00 |
370.923 |
0.00 |
100.00 |
|
0.100 |
0.00 |
0.00 |
6.849 |
0.00 |
100.00 |
469.098 |
0.00 |
100.00 |
|
0.126 |
0.00 |
0.00 |
8.662 |
0.00 |
100.00 |
593.257 |
0.00 |
100.00 |
|
0.160 |
0.00 |
0.00 |
10.954 |
0.00 |
100.00 |
90.658 |
0.00 |
100.00 |
|
0.202 |
0.00 |
0.00 |
13.854 |
0.00 |
100.00 |
114.653 |
0.00 |
100.00 |
|
0.256 |
0.12 |
0.12 |
17.521 |
0.00 |
100.00 |
144.999 |
0.00 |
100.00 |
|
0.324 |
0.60 |
0.72 |
22.158 |
0.00 |
100.00 |
183.377 |
0.00 |
100.00 |
|
0.409 |
1.47 |
2.19 |
28.023 |
0.00 |
100.00 |
750.278 |
0.00 |
100.00 |
|
0.517 |
2.75 |
4.94 |
35.440 |
0.00 |
100.00 |
948.859 |
0.00 |
100.00 |
|
0.654 |
4.71 |
9.64 |
44.820 |
0.00 |
100.00 |
1,200.000 |
0.00 |
100.00 |
|
0.828 |
7.40 |
17.04 |
56.682 |
0.00 |
100.00 |
1,517.612 |
0.00 |
100.00 |
|
1.047 |
10.85 |
27.89 |
71.685 |
0.00 |
100.00 |
1,919.288 |
0.00 |
100.00 |
Application :
- Thermal Interface Materials (TIM) : Used in thermal greases, thermal gels, thermal pads, phase change materials, etc., as an AlN thermal interface material (TIM) filler to improve packing density and thermal performance.
- Semiconductor & Power Electronics Cooling: Used in thermal packaging for CPUs, GPUs, IGBT power modules, power converters, and other devices, functioning as AlN power electronics cooling powder to efficiently dissipate heat from high-power components.
- LED Lighting & Optoelectronics: Used in heat dissipation substrates and thermal packaging materials for high-power LEDs, serving as AlN LED heat dissipation filler to extend device lifetime and maintain luminous efficacy.
- New Energy Vehicles & Electronic Control Systems: Used in thermally conductive potting compounds and thermal pads for inverters, battery management systems (BMS), on-board chargers (OBC), and other electronic control units, acting as AlN new energy vehicle electronic control cooling powder to provide both thermal management and electrical insulation.
- Optical Module Thermal Management and Packaging: Used in thermal interface materials for 800G/1.6T optical modules, where high thermal conductivity is critical for signal integrity and reliability. Polymer Matrix Composites: Added to polymer matrices such as epoxy resins and silicone rubbers to produce high-thermal-conductivity, electrically insulating composite materials, serving as AlN polymer composite filler for electronic encapsulation and potting applications.
Package
10kg/bucket
aluminum nitride filler is packed in aluminum foil bags filled with nitrogen and then in iron drums.
Our advantage
Xiamen JUCI Technology Co., Ltd. is a specialized manufacturer of aluminum nitride (AlN) powder and ceramic products, built on over 20 years of R&D collaboration with the University of Science and Technology Beijing (USTB). With a current annual capacity of 1,000 tons, the company is expanding its Inner Mongolia production base to reach 1,200 tons per year in the first phase, with a long‑term goal of 5,000 tons annually. Our thermal filler powder series currently maintains a monthly production volume of 20 tons (240 tons annually), serving a growing number of customers in the TIM industry. Its product line includes both polycrystalline and single‑crystal filler powders from 1μm to 150μm, designed for thermal interface materials (TIM) such as thermal greases and thermal pads.
Company Production Line
Partial List of R&D and Testing Equipment
Company Honors and Certifications
Company Patents
Tags :
WhatsApp : +8618250812806
WhatsApp : wechat: JENNY-8866
Email : chenxiaofang@chinajuci.com
Email : qinxianhui@chinajuci.com
Tel : +8618250812806
Tel : +8615151778700
