AlN in thermal adhesives

The S-Series 80μm AlN thermal conductive filler is a high-performance thermal management material designed for high-power electronics, 5G communications, new energy vehicles, LED lighting, and advanced chip cooling applications. Utilizing proprietary particle gradation technology and surface modification processes, this product achieves an ultra-high thermal conductivity, significantly improving heat dissipation efficiency and ensuring stable, long-lasting performance for modern electronic devices. Key Features: 1、Exceptional Thermal Conductivity Made from high-purity ceramic materials (such as aluminum nitride) and optimized 80μm particle distribution, it forms a dense thermal conduction network, increasing thermal conductivity compared to conventional fillers and effectively reducing interfacial thermal resistance. 2、Precise Particle Size Control The fine 80μm particles provide excellent filling capability, ensuring tight contact with matrix materials (e.g., silicone, epoxy resin) and minimizing voids for rapid, uniform heat transfer. 3、Superior Electrical Insulation Maintains high insulation properties (volume resistivity >10¹⁴ Ω·cm) while enhancing thermal performance, making it ideal for sensitive electronic components. 4、Strong Chemical Stability Resistant to high temperatures and corrosion,  suitable for harsh operating environments. 5、Excellent Compatibility Can be easily incorporated into thermal greases, thermal pads, adhesives, and other composite materials to meet diverse application requirements.