AlN production

Xiamen Juci Technology Co., Ltd. introduces high thermal conductivity aluminum nitride (AlN) gap filler powder (120μm), a high thermal conductivity interface material designed for advanced thermal applications. With exceptional thermal conductivity (theoretical value: 170-200 W/m·K), low dielectric constant, and outstanding insulation properties, this product is an ideal choice for electronic packaging, composite materials, thermal interface materials, and more. The precisely controlled 120μm particle size ensures excellent dispersibility and packing density, significantly enhancing the thermal management efficiency of matrix materials. Key Features: 1、Ultra-High Thermal Conductivity: Dramatically improves the thermal performance of ceramic and polymer composites, ensuring stable operation of electronic devices by efficiently dissipating heat. Forms an effective thermal network for rapid heat transfer, reducing operating temperatures. 2、 Low Oxygen Content & High Crystallinity: Low oxygen content enhances intrinsic thermal conductivity, while high crystallinity ensures stable and reliable performance even in harsh environments. 3、Narrow Particle Size Distribution & Excellent Flowability: Precisely controlled 120μm particle size with uniform isometric morphology ensures easy dispersion during production and consistent end-product performance, minimizing defect rates. 4、 Superior Hydrolysis Resistance: Surface-modified for excellent moisture resistance, ensuring long-term storage stability without performance degradation.