aluminum nitride (AlN) fillers manufacturer

The 80μm Aluminum Nitride (AlN) Filler, developed by Xiamen Juci Technology, is a high-performance ceramic material designed for electronic packaging, thermal interface materials (TIMs), and high-thermal-conductivity composites. Featuring a precisely controlled particle size distribution (D50≈80μm), ultra-high purity (≥99%), and exceptional thermal conductivity (170-200 W/(m·K)), it significantly enhances the thermal management efficiency of polymer, metal, or ceramic matrices. It is ideal for demanding heat dissipation applications in 5G communications, new energy vehicles, power electronics, and more. Key Features: 1、Exceptional Thermal Conductivity Theoretical thermal conductivity of 170–200 W/(m·K), effectively addressing thermal management challenges in electronic devices.  2、Precise Particle Size Control Uniform distribution with an average particle size (D50) of 80μm ensures excellent dispersibility and compatibility with resin, metal, or ceramic matrices.  3、High Purity, Low Oxygen Content Purity ≥ 99%, oxygen content ≤ 1%, guaranteeing chemical stability and electrical insulation for high-frequency, high-voltage applications.  4、Low Dielectric Constant & Loss Low dielectric constant (ε ≈ 8.8) and minimal dielectric loss (tanδ < 0.001), ideal for high-frequency circuit packaging.  5、Outstanding Mechanical Properties High hardness and wear resistance enhance the mechanical strength of composites.