aluminum nitride (AlN) filler

Xiamen Juci Technology Co., Ltd. introduces its high thermal conductivity series 100μm polycrystalline aluminum nitride (AlN) filler powder, a high-purity ceramic filler designed for advanced thermal management composites. Utilizing cutting-edge synthesis and classification technology, this product delivers exceptional thermal conductivity, excellent chemical stability, and optimized particle size distribution. It significantly enhances the heat dissipation performance of polymers, adhesives, and ceramic matrices, making it ideal for applications in electronic packaging, LED cooling, 5G communication devices, and high-power modules. Key Features: 1、Ultra-High Thermal Conductivity Polycrystalline AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), effectively addressing high heat flux dissipation challenges in electronic components. Low coefficient of thermal expansion (≈4.6×10⁻⁶/K), matching semiconductor materials to minimize interfacial stress. 2、Precise Particle Size Control D50 ≈ 100μm, with uniform particle distribution, optimizing packing density to form efficient thermal pathways. Customizable surface treatments (e.g., silane coupling agent modification) to improve compatibility with resins and metals. 3、High Purity & Reliability Purity ≥ 99%, oxygen content < 1%, ensuring minimal impact on dielectric properties. High-temperature resistance (>1800°C) and corrosion resistance, suitable for harsh environments. 4、Versatile Applications Thermal Adhesives/Pastes: Increases thermal conductivity when filled. Ceramic Matrix Composites: Used for high-thermal-conductivity insulating substrates or packaging materials. Thermal Interface Materials (TIMs): Reduces contact thermal resistance in electronic assemblies.

The 80μm Aluminum Nitride (AlN) Filler, developed by Xiamen Juci Technology, is a high-performance ceramic material designed for electronic packaging, thermal interface materials (TIMs), and high-thermal-conductivity composites. Featuring a precisely controlled particle size distribution (D50≈80μm), ultra-high purity (≥99%), and exceptional thermal conductivity (170-200 W/(m·K)), it significantly enhances the thermal management efficiency of polymer, metal, or ceramic matrices. It is ideal for demanding heat dissipation applications in 5G communications, new energy vehicles, power electronics, and more. Key Features: 1、Exceptional Thermal Conductivity Theoretical thermal conductivity of 170–200 W/(m·K), effectively addressing thermal management challenges in electronic devices.  2、Precise Particle Size Control Uniform distribution with an average particle size (D50) of 80μm ensures excellent dispersibility and compatibility with resin, metal, or ceramic matrices.  3、High Purity, Low Oxygen Content Purity ≥ 99%, oxygen content ≤ 1%, guaranteeing chemical stability and electrical insulation for high-frequency, high-voltage applications.  4、Low Dielectric Constant & Loss Low dielectric constant (ε ≈ 8.8) and minimal dielectric loss (tanδ < 0.001), ideal for high-frequency circuit packaging.  5、Outstanding Mechanical Properties High hardness and wear resistance enhance the mechanical strength of composites.

Xiamen Juci Technology Co., Ltd. presents its 150μm high-purity aluminum nitride (AlN) filler powder, a functional ceramic filler designed for high-performance thermally conductive composite materials. With key advantages including ultra-fine particle size (150 microns), high purity (≥99%), and low oxygen content, this product significantly enhances the thermal conductivity of polymer, metal, or ceramic matrix composites. It is widely used in electronic packaging, thermal interface materials (TIMs), high-power LED heat dissipation, and more. Key Features: 1、Exceptional Thermal Conductivity AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), over five times higher than conventional alumina fillers, dramatically improving the overall thermal efficiency of composite materials. 2、Precise Particle Size Distribution D50: 150μm, uniform particle size, smooth surface, and excellent dispersibility ensure efficient thermal conductive network formation in the matrix. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing impurities' impact on dielectric properties and thermal conductivity, making it ideal for high-frequency electronic devices. 4、Superior Electrical Insulation Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (~8.8), suitable for high-insulation-demanding electronic packaging. 5、Strong Chemical Stability High-temperature resistance (stable in air up to 1400°C), corrosion resistance, and excellent compatibility with epoxy resins, silicone gels, and other matrix materials.

Xiamen Juceri Technology's 120μm Aluminum Nitride (AlN) filler powder is a high-purity, high-thermal-conductivity ceramic powder material, specifically designed for high-performance thermally conductive composites, electronic packaging, thermal interface materials (TIM), and high-thermal-conductivity plastics/rubbers. With its uniform particle size distribution (D50≈120μm) and excellent chemical stability, it significantly enhances the thermal conductivity of matrix materials while maintaining superior electrical insulation and mechanical strength. Key Features: 1、Ultra-High Thermal Conductivity Theoretical thermal conductivity of 170-200 W/(m·K), effectively improving the heat dissipation efficiency of composite materials. 2、Precise Particle Size Control Median particle size (D50) of 120μm with uniform distribution, ensuring easy dispersion and strong compatibility with resin/polymer matrices. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing the impact of impurities on dielectric properties and thermal conductivity. 4、Excellent Insulation Performance Volume resistivity >10¹⁴ Ω·cm, suitable for electronic applications requiring high insulation. 5、Chemical Stability Resistant to high temperatures and corrosion, maintaining stable performance in high-temperature or humid environments. 6、Surface Modifiability Can be treated with silane coupling agents or other surface modifications upon request to enhance interfacial bonding with the matrix.

50μm aluminum nitride (AlN) ceramic microspheres are a high-performance thermal filler designed to enhance the thermal management properties of composite materials. With excellent thermal conductivity (~170-200 W/mK) and superior electrical insulation, AlN microspheres are an ideal choice for electronic packaging, thermally conductive adhesives, thermally conductive plastics, and high-power LED heat dissipation. Key Features: 1、High Thermal Conductivity: Effectively improves heat transfer efficiency in composites, ideal for critical cooling applications. 2、Uniform Particle Size: 50μm microspheres ensure even dispersion, optimizing mechanical and thermal performance. 3、Electrical Insulation: High resistivity makes it suitable for insulation requirements in electronics. 4、High-Temperature & Oxidation Resistance: Exceptional stability for high-temperature environments. 5、Lightweight: Low density reduces overall product weight.