aluminum nitride (AlN) powder manufacturer

Xiamen Juci Technology Co., Ltd. introduces its high thermal conductivity series 100μm polycrystalline aluminum nitride (AlN) filler powder, a high-purity ceramic filler designed for advanced thermal management composites. Utilizing cutting-edge synthesis and classification technology, this product delivers exceptional thermal conductivity, excellent chemical stability, and optimized particle size distribution. It significantly enhances the heat dissipation performance of polymers, adhesives, and ceramic matrices, making it ideal for applications in electronic packaging, LED cooling, 5G communication devices, and high-power modules. Key Features: 1、Ultra-High Thermal Conductivity Polycrystalline AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), effectively addressing high heat flux dissipation challenges in electronic components. Low coefficient of thermal expansion (≈4.6×10⁻⁶/K), matching semiconductor materials to minimize interfacial stress. 2、Precise Particle Size Control D50 ≈ 100μm, with uniform particle distribution, optimizing packing density to form efficient thermal pathways. Customizable surface treatments (e.g., silane coupling agent modification) to improve compatibility with resins and metals. 3、High Purity & Reliability Purity ≥ 99%, oxygen content < 1%, ensuring minimal impact on dielectric properties. High-temperature resistance (>1800°C) and corrosion resistance, suitable for harsh environments. 4、Versatile Applications Thermal Adhesives/Pastes: Increases thermal conductivity when filled. Ceramic Matrix Composites: Used for high-thermal-conductivity insulating substrates or packaging materials. Thermal Interface Materials (TIMs): Reduces contact thermal resistance in electronic assemblies.

The S-Series 80μm AlN thermal conductive filler is a high-performance thermal management material designed for high-power electronics, 5G communications, new energy vehicles, LED lighting, and advanced chip cooling applications. Utilizing proprietary particle gradation technology and surface modification processes, this product achieves an ultra-high thermal conductivity, significantly improving heat dissipation efficiency and ensuring stable, long-lasting performance for modern electronic devices. Key Features: 1、Exceptional Thermal Conductivity Made from high-purity ceramic materials (such as aluminum nitride) and optimized 80μm particle distribution, it forms a dense thermal conduction network, increasing thermal conductivity compared to conventional fillers and effectively reducing interfacial thermal resistance. 2、Precise Particle Size Control The fine 80μm particles provide excellent filling capability, ensuring tight contact with matrix materials (e.g., silicone, epoxy resin) and minimizing voids for rapid, uniform heat transfer. 3、Superior Electrical Insulation Maintains high insulation properties (volume resistivity >10¹⁴ Ω·cm) while enhancing thermal performance, making it ideal for sensitive electronic components. 4、Strong Chemical Stability Resistant to high temperatures and corrosion,  suitable for harsh operating environments. 5、Excellent Compatibility Can be easily incorporated into thermal greases, thermal pads, adhesives, and other composite materials to meet diverse application requirements.