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  • AlN Injection-Molded Custom Ceramic Parts
    Our Aluminum Nitride (AlN) Injection-Molded Custom Ceramic Parts combine advanced injection molding technology with high-purity AlN ceramic materials. Designed for complex, irregular shapes, this product breaks the limitations of traditional ceramic processing, enabling precise manufacturing of components with tight tolerances  and intricate geometries—ideal for industries requiring both performance and design flexibility.   Key Feature Superior Thermal Conductivity: ≥170 W/(m·K) thermal conductivity, 5-10x higher than alumina ceramics, ensuring efficient heat dissipation for high-power electronics.​   Excellent Electrical Insulation: Volume resistivity ≥10¹⁴ Ω·cm, protecting sensitive circuits while transferring heat.​   Customizable Shapes: Injection molding supports one-step production of complex structures (e.g., grooves, holes, curved surfaces) without secondary processing, reducing costs by 30% vs. traditional machining.​   High Mechanical Strength: Flexural strength ≥300 MPa, ensuring durability in harsh environments (temperature range: -200℃ to 800℃).​   Low Thermal Expansion: Coefficient of thermal expansion (CTE) matching silicon (≈4.5×10⁻⁶/℃), minimizing thermal stress in electronic assemblies.  
  • Mini Aluminum Nitride Ceramic Crucible: Outstanding Performance & Versatile Applications
    In the field of high-temperature applications, the requirements for material performance are becoming increasingly stringent. Our mini aluminum nitride ceramic crucible, with its exceptional performance, has become an ideal choice for numerous industries. 1、Ultra-High Thermal Conductivity: The mini aluminum nitride ceramic crucible boasts an ultra-high thermal conductivity, ensuring efficient heat transfer. Whether for non-ferrous metal smelting or semiconductor material synthesis, it can distribute heat quickly and evenly, greatly improving process efficiency while reducing energy consumption and supporting sustainable industrial operations. 2、Excellent Thermal Stability: It can withstand extreme high temperatures. As a high-temperature refractory crucible, it still operates stably in harsh environments where other materials are incompetent, ensuring long-term reliable performance, reducing downtime, and improving production efficiency. 3、Superior Chemical Resistance: It has excellent resistance to corrosion, does not react with non-ferrous metals such as copper, aluminum, and silver, and can also resist the dissolution of aluminum, iron, and aluminum alloys. In semiconductor applications, its stability against molten salts like gallium arsenide is particularly crucial, which can prevent silicon contamination and ensure the production of high-purity semiconductor materials.  
  • Aluminum Nitride (ALN) Rings with Various Diameter
    Aluminum Nitride (AlN) ceramic rings are high-performance specialized ceramic components made from high-purity aluminum nitride powder through precision molding and high-temperature sintering processes. With outstanding thermal conductivity, electrical insulation, high-temperature resistance, and low thermal expansion coefficient, AlN ceramic rings are widely used in semiconductor equipment, high-power LEDs, RF/microwave devices, and other fields, making them an indispensable key material in modern industry.   Core Features & Advantages 1、Exceptional Thermal Conductivity Thermal conductivity up to 170-220 W/(m·K), close to that of aluminum and far exceeding alumina ceramics (~30 W/(m·K)), ensuring efficient heat dissipation for high-power devices.  2、Superior Electrical Insulation  Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (8-9), suitable for high-frequency and high-voltage environments, ensuring safe and stable circuit operation.  3、High-Temperature Stability  Withstands temperatures up to 2200°C, maintaining structural stability under extreme thermal cycling conditions and exhibiting excellent thermal shock resistance.  4、Low Thermal Expansion Coefficient  Thermal expansion coefficient (4.5×10⁻⁶/℃–4.9×10⁻⁶/℃) matches silicon (Si) chips, reducing thermal stress and extending device lifespan.  5、Chemical Inertness & Mechanical Strength  Resistant to acid/alkali corrosion and oxidation; high hardness (Mohs 8-9), wear-resistant, and impact-resistant.

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