High Thermal Conductivity AlN Ceramic

Aluminum Nitride (AlN) ceramic square sheets are precision-engineered ceramic materials manufactured from high-purity AlN powder through advanced sintering technology. Renowned for their exceptional thermal conductivity, electrical insulation, and thermo-mechanical properties, AlN ceramic sheets are widely used in high-power electronics, LED packaging, semiconductor devices, RF/microwave components, and more, making them a critical material in modern electronics   Core Features & Advantages Ultra-high thermal conductivity (180-220 W/m·K) - 5-10x better than alumina for efficient heat dissipation Excellent electrical insulation (10¹⁴ Ω·cm) - ideal for high-voltage applications Proven reliability in power electronics (IGBTs, power modules) and optoelectronics (LEDs, laser diodes) Critical solution for EV power systems and rail converters requiring both thermal management and electrical isolation  

Aluminum Nitride (AlN) ceramic rings are high-performance specialized ceramic components made from high-purity aluminum nitride powder through precision molding and high-temperature sintering processes. With outstanding thermal conductivity, electrical insulation, high-temperature resistance, and low thermal expansion coefficient, AlN ceramic rings are widely used in semiconductor equipment, high-power LEDs, RF/microwave devices, and other fields, making them an indispensable key material in modern industry.   Core Features & Advantages 1、Exceptional Thermal Conductivity Thermal conductivity up to 170-220 W/(m·K), close to that of aluminum and far exceeding alumina ceramics (~30 W/(m·K)), ensuring efficient heat dissipation for high-power devices.  2、Superior Electrical Insulation  Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (8-9), suitable for high-frequency and high-voltage environments, ensuring safe and stable circuit operation.  3、High-Temperature Stability  Withstands temperatures up to 2200°C, maintaining structural stability under extreme thermal cycling conditions and exhibiting excellent thermal shock resistance.  4、Low Thermal Expansion Coefficient  Thermal expansion coefficient (4.5×10⁻⁶/℃–4.9×10⁻⁶/℃) matches silicon (Si) chips, reducing thermal stress and extending device lifespan.  5、Chemical Inertness & Mechanical Strength  Resistant to acid/alkali corrosion and oxidation; high hardness (Mohs 8-9), wear-resistant, and impact-resistant.

Our aluminum nitride (AlN) ceramic balls excel in high thermal conductivity, low thermal expansion, excellent electrical insulation, and outstanding mechanical strength, making them ideal for demanding industrial applications. Manufactured using high-purity materials and advanced sintering technology, our AlN ceramic balls ensure high density and low porosity for superior performance in extreme conditions.   Why Choose Our AlN Ceramic Balls? Ultra-High Thermal Conductivity (170-200 W/m·K) – Ideal for efficient heat dissipation Low Thermal Expansion– Ensures stability in high-temperature environments High Strength & Wear Resistance – Extended service life Excellent Electrical Insulation – Perfect for electronics and semiconductor applications Corrosion & Oxidation Resistant – Suitable for harsh conditions in chemical and aerospace industries