aln ceramic substrate

Xiamen Juci Technology Co., Ltd. presents its 150μm high-purity aluminum nitride (AlN) filler powder, a functional ceramic filler designed for high-performance thermally conductive composite materials. With key advantages including ultra-fine particle size (150 microns), high purity (≥99%), and low oxygen content, this product significantly enhances the thermal conductivity of polymer, metal, or ceramic matrix composites. It is widely used in electronic packaging, thermal interface materials (TIMs), high-power LED heat dissipation, and more. Key Features: 1、Exceptional Thermal Conductivity AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), over five times higher than conventional alumina fillers, dramatically improving the overall thermal efficiency of composite materials. 2、Precise Particle Size Distribution D50: 150μm, uniform particle size, smooth surface, and excellent dispersibility ensure efficient thermal conductive network formation in the matrix. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing impurities' impact on dielectric properties and thermal conductivity, making it ideal for high-frequency electronic devices. 4、Superior Electrical Insulation Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (~8.8), suitable for high-insulation-demanding electronic packaging. 5、Strong Chemical Stability High-temperature resistance (stable in air up to 1400°C), corrosion resistance, and excellent compatibility with epoxy resins, silicone gels, and other matrix materials.

Aluminum nitride heat sinks are high thermal conductivity materials with high strength, high hardness, excellent wear resistance, and good corrosion resistance. Its thermal conductivity is extremely high, approximately five times that of aluminum and three times that of copper, making it one of the highest thermal conductive materials currently available. Additionally, aluminum nitride heat sinks possess very high strength, allowing them to withstand significant pressure and tensile forces without deforming or damaging easily. They also exhibit good corrosion and wear resistance, enabling them to operate stably in harsh environments for extended periods. Aluminum nitride heat sinks are widely used in various fields such as electronics, LED lighting, automotive electronics, and aerospace for heat dissipation and thermal management, particularly in high-power electronic devices. Due to their unique physical and chemical properties, they can quickly dissipate generated heat, maintaining a stable operating temperature for equipment while also extending its lifespan.      

Aluminum nitride thermal conductivity ceramics have a high thermal conductivity of 180 W/m·K, making them one of the highest thermal conductivity materials among non-metallic substances (7-10 times that of aluminum oxide ceramics). They feature excellent mechanical properties, good machinability, high dimensional accuracy, a smooth surface, and no micro-cracks or warping. Their low dielectric constant and low dielectric loss ensure optimal electrical insulation performance. The material is environmentally friendly and non-toxic, can withstand temperatures up to 1800°C, is resistant to oil and chemical corrosion, and has a thermal expansion coefficient similar to silicon, with no hygroscopicity. It maintains stable performance and high reliability under high temperature and humidity conditions. With the widespread development of microelectronics, high thermal conductivity aluminum nitride ceramics are increasingly valued and used as substrate or packaging materials,such as aluminum nitride sheet,aln ceramic substrate,aluminum nitride thermal pad.