AlN Powder manufacturer

Xiamen Juci Technology Co., Ltd. presents its 150μm high-purity aluminum nitride (AlN) filler powder, a functional ceramic filler designed for high-performance thermally conductive composite materials. With key advantages including ultra-fine particle size (150 microns), high purity (≥99%), and low oxygen content, this product significantly enhances the thermal conductivity of polymer, metal, or ceramic matrix composites. It is widely used in electronic packaging, thermal interface materials (TIMs), high-power LED heat dissipation, and more. Key Features: 1、Exceptional Thermal Conductivity AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), over five times higher than conventional alumina fillers, dramatically improving the overall thermal efficiency of composite materials. 2、Precise Particle Size Distribution D50: 150μm, uniform particle size, smooth surface, and excellent dispersibility ensure efficient thermal conductive network formation in the matrix. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing impurities' impact on dielectric properties and thermal conductivity, making it ideal for high-frequency electronic devices. 4、Superior Electrical Insulation Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (~8.8), suitable for high-insulation-demanding electronic packaging. 5、Strong Chemical Stability High-temperature resistance (stable in air up to 1400°C), corrosion resistance, and excellent compatibility with epoxy resins, silicone gels, and other matrix materials.

30μm Aluminum Nitride (AlN) Ceramic Microspheres are high-performance inorganic non-metallic materials exhibiting outstanding thermal conductivity, electrical insulation, high-temperature resistance, and chemical stability. Their micron-scale spherical structure enables broad application prospects in advanced electronic packaging, composite reinforcement, thermal interface materials, and other fields. Key Features of 30μm Aluminum Nitride (AlN) Ceramic Microspheres: High Thermal Conductivity – With 170-200 W/(m·K) thermal conductivity, AlN microspheres significantly enhance heat dissipation in thermal interface materials (TIMs) and electronic packaging. Excellent Electrical Insulation – Ultra-high resistivity (>10¹⁴ Ω·cm) makes these AlN fillers ideal for high-voltage applications, PCB substrates, and insulating coatings. High-Temperature Resistance – Melting point of 2200°C ensures stability in extreme environments, suitable for aerospace, power electronics, and LED heat sinks. Low CTE (4.5×10⁻⁶/°C) – Matches semiconductor materials (Si, GaN, SiC), reducing thermal stress in chip packaging and power modules. High Purity & Chemical Stability – Corrosion-resistant and acid/alkali-proof, perfect for harsh industrial applications and chemical environments. Uniform Spherical Structure – Narrow particle distribution (D50≈30μm) ensures superior flowability and even dispersion in polymers, composites, and 3D printing materials.