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150μm aluminum nitride filler
aluminum nitride filler
High Thermal Conductivity Powder

Premium 150μm Aluminum Nitride Powder for TIMs, LED & Electronic Packaging

Xiamen Juci Technology Co., Ltd. presents its 150μm high-purity aluminum nitride (AlN) filler powder, a functional ceramic filler designed for high-performance thermally conductive composite materials. With key advantages including ultra-fine particle size (150 microns), high purity (≥99%), and low oxygen content, this product significantly enhances the thermal conductivity of polymer, metal, or ceramic matrix composites. It is widely used in electronic packaging, thermal interface materials (TIMs), high-power LED heat dissipation, and more.

Key Features:

1、Exceptional Thermal Conductivity

AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), over five times higher than conventional alumina fillers, dramatically improving the overall thermal efficiency of composite materials.

2、Precise Particle Size Distribution

D50: 150μm, uniform particle size, smooth surface, and excellent dispersibility ensure efficient thermal conductive network formation in the matrix.

3、High Purity & Low Oxygen Content

Purity ≥99%, oxygen content ≤1%, minimizing impurities' impact on dielectric properties and thermal conductivity, making it ideal for high-frequency electronic devices.

4、Superior Electrical Insulation

Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (~8.8), suitable for high-insulation-demanding electronic packaging.

5、Strong Chemical Stability

High-temperature resistance (stable in air up to 1400°C), corrosion resistance, and excellent compatibility with epoxy resins, silicone gels, and other matrix materials.

  • Item No :

    F-150
  • Size :

    150μm
  • Order(MOQ) :

    1KG
  • Product Origin :

    CHINA
  • Color :

    Gray-white

150μm AlN filler

 

Item F-150
D50 (μm) 150
D90(um) 195
Particle shape Spherical
Specific surface area (m2/g) 3.31
Bulk density (g/cm3) 1.8
Tap density (g/cm3) 2.0
 
Remark: The values above are typical values.

Application :

Electronic Packaging: Thermal enhancement AlN filler for IC substrates and ceramic circuit boards (e.g., DPC, HTCC).

Thermal Interface Materials (TIMs): AlN filler in thermal greases and pads, reducing thermal contact resistance between chips and heat sinks.

High-Power Device Cooling: Heat dissipation for LED chips, 5G RF modules, and IGBT modules.

Specialty Ceramics: Used in high-thermal-conductivity AlN ceramic substrates or composites.

Thermal interface materials

 

 

 

 

 

Package

10-20kg/bucket

Aluminum nitride filler is packed in aluminum foil bags filled with nitrogen and then in iron drums.

aluminum nitride packagealuminum nitride package

 

The advantages of Xiamen Juci Technology Co., Ltd.

As a leading aluminum nitride (AlN) manufacturer, we deliver superior ceramic solutions with:

1、 High-Performance Powders

≥99% purity with ≤1% oxygen content

2、Controlled particle size (D50≈120μm)

Excellent thermal conductivity (170-200 W/m·K)

3、Customized Solutions

Tailored formulations for electronics & energy applications

Surface modification options available

4、Reliable Production

Strict ISO 9001 quality control

Stable global supply with consistent quality

5、Technical Expertise

Continuous R&D for advanced thermal management

Application-specific technical support

We combine precision manufacturing with innovative material science to power your thermal solutions.

 

Company and Laboratory 

juci company

 

Media Contact:
Xiamen Juci Technology Co., Ltd.

Phone: +86 592 7080230
Email: miki_huang@chinajuci.com
Website: www.jucialnglobal.com

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