Xiamen Juci Technology Co., Ltd. presents its 150μm high-purity aluminum nitride (AlN) filler powder, a functional ceramic filler designed for high-performance thermally conductive composite materials. With key advantages including ultra-fine particle size (150 microns), high purity (≥99%), and low oxygen content, this product significantly enhances the thermal conductivity of polymer, metal, or ceramic matrix composites. It is widely used in electronic packaging, thermal interface materials (TIMs), high-power LED heat dissipation, and more.
Key Features:
1、Exceptional Thermal Conductivity
AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), over five times higher than conventional alumina fillers, dramatically improving the overall thermal efficiency of composite materials.
2、Precise Particle Size Distribution
D50: 150μm, uniform particle size, smooth surface, and excellent dispersibility ensure efficient thermal conductive network formation in the matrix.
3、High Purity & Low Oxygen Content
Purity ≥99%, oxygen content ≤1%, minimizing impurities' impact on dielectric properties and thermal conductivity, making it ideal for high-frequency electronic devices.
4、Superior Electrical Insulation
Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (~8.8), suitable for high-insulation-demanding electronic packaging.
5、Strong Chemical Stability
High-temperature resistance (stable in air up to 1400°C), corrosion resistance, and excellent compatibility with epoxy resins, silicone gels, and other matrix materials.
Item No :
F-150Size :
150μmOrder(MOQ) :
1KGProduct Origin :
CHINAColor :
Gray-white
Item | F-150 |
D50 (μm) | 150 |
D90(um) | 195 |
Particle shape | Spherical |
Specific surface area (m2/g) | 3.31 |
Bulk density (g/cm3) | 1.8 |
Tap density (g/cm3) | 2.0 |
Application :
Electronic Packaging: Thermal enhancement AlN filler for IC substrates and ceramic circuit boards (e.g., DPC, HTCC).
Thermal Interface Materials (TIMs): AlN filler in thermal greases and pads, reducing thermal contact resistance between chips and heat sinks.
High-Power Device Cooling: Heat dissipation for LED chips, 5G RF modules, and IGBT modules.
Specialty Ceramics: Used in high-thermal-conductivity AlN ceramic substrates or composites.
Package
10-20kg/bucket
Aluminum nitride filler is packed in aluminum foil bags filled with nitrogen and then in iron drums.
The advantages of Xiamen Juci Technology Co., Ltd.
As a leading aluminum nitride (AlN) manufacturer, we deliver superior ceramic solutions with:
1、 High-Performance Powders
≥99% purity with ≤1% oxygen content
2、Controlled particle size (D50≈120μm)
Excellent thermal conductivity (170-200 W/m·K)
3、Customized Solutions
Tailored formulations for electronics & energy applications
Surface modification options available
4、Reliable Production
Strict ISO 9001 quality control
Stable global supply with consistent quality
5、Technical Expertise
Continuous R&D for advanced thermal management
Application-specific technical support
We combine precision manufacturing with innovative material science to power your thermal solutions.
Company and Laboratory
Media Contact:
Xiamen Juci Technology Co., Ltd.
Phone: +86 592 7080230
Email: miki_huang@chinajuci.com
Website: www.jucialnglobal.com
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