aluminum nitride (AlN) ceramic microspheres

50μm aluminum nitride (AlN) ceramic microspheres are a high-performance thermal filler designed to enhance the thermal management properties of composite materials. With excellent thermal conductivity (~170-200 W/mK) and superior electrical insulation, AlN microspheres are an ideal choice for electronic packaging, thermally conductive adhesives, thermally conductive plastics, and high-power LED heat dissipation. Key Features: 1、High Thermal Conductivity: Effectively improves heat transfer efficiency in composites, ideal for critical cooling applications. 2、Uniform Particle Size: 50μm microspheres ensure even dispersion, optimizing mechanical and thermal performance. 3、Electrical Insulation: High resistivity makes it suitable for insulation requirements in electronics. 4、High-Temperature & Oxidation Resistance: Exceptional stability for high-temperature environments. 5、Lightweight: Low density reduces overall product weight.

30μm Aluminum Nitride (AlN) Ceramic Microspheres are high-performance inorganic non-metallic materials exhibiting outstanding thermal conductivity, electrical insulation, high-temperature resistance, and chemical stability. Their micron-scale spherical structure enables broad application prospects in advanced electronic packaging, composite reinforcement, thermal interface materials, and other fields. Key Features of 30μm Aluminum Nitride (AlN) Ceramic Microspheres: High Thermal Conductivity – With 170-200 W/(m·K) thermal conductivity, AlN microspheres significantly enhance heat dissipation in thermal interface materials (TIMs) and electronic packaging. Excellent Electrical Insulation – Ultra-high resistivity (>10¹⁴ Ω·cm) makes these AlN fillers ideal for high-voltage applications, PCB substrates, and insulating coatings. High-Temperature Resistance – Melting point of 2200°C ensures stability in extreme environments, suitable for aerospace, power electronics, and LED heat sinks. Low CTE (4.5×10⁻⁶/°C) – Matches semiconductor materials (Si, GaN, SiC), reducing thermal stress in chip packaging and power modules. High Purity & Chemical Stability – Corrosion-resistant and acid/alkali-proof, perfect for harsh industrial applications and chemical environments. Uniform Spherical Structure – Narrow particle distribution (D50≈30μm) ensures superior flowability and even dispersion in polymers, composites, and 3D printing materials.