AlN fillers

Xiamen Juci Technology Co., Ltd. introduces its high thermal conductivity series 100μm polycrystalline aluminum nitride (AlN) filler powder, a high-purity ceramic filler designed for advanced thermal management composites. Utilizing cutting-edge synthesis and classification technology, this product delivers exceptional thermal conductivity, excellent chemical stability, and optimized particle size distribution. It significantly enhances the heat dissipation performance of polymers, adhesives, and ceramic matrices, making it ideal for applications in electronic packaging, LED cooling, 5G communication devices, and high-power modules. Key Features: 1、Ultra-High Thermal Conductivity Polycrystalline AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), effectively addressing high heat flux dissipation challenges in electronic components. Low coefficient of thermal expansion (≈4.6×10⁻⁶/K), matching semiconductor materials to minimize interfacial stress. 2、Precise Particle Size Control D50 ≈ 100μm, with uniform particle distribution, optimizing packing density to form efficient thermal pathways. Customizable surface treatments (e.g., silane coupling agent modification) to improve compatibility with resins and metals. 3、High Purity & Reliability Purity ≥ 99%, oxygen content < 1%, ensuring minimal impact on dielectric properties. High-temperature resistance (>1800°C) and corrosion resistance, suitable for harsh environments. 4、Versatile Applications Thermal Adhesives/Pastes: Increases thermal conductivity when filled. Ceramic Matrix Composites: Used for high-thermal-conductivity insulating substrates or packaging materials. Thermal Interface Materials (TIMs): Reduces contact thermal resistance in electronic assemblies.

The 80μm Aluminum Nitride (AlN) Filler, developed by Xiamen Juci Technology, is a high-performance ceramic material designed for electronic packaging, thermal interface materials (TIMs), and high-thermal-conductivity composites. Featuring a precisely controlled particle size distribution (D50≈80μm), ultra-high purity (≥99%), and exceptional thermal conductivity (170-200 W/(m·K)), it significantly enhances the thermal management efficiency of polymer, metal, or ceramic matrices. It is ideal for demanding heat dissipation applications in 5G communications, new energy vehicles, power electronics, and more. Key Features: 1、Exceptional Thermal Conductivity Theoretical thermal conductivity of 170–200 W/(m·K), effectively addressing thermal management challenges in electronic devices.  2、Precise Particle Size Control Uniform distribution with an average particle size (D50) of 80μm ensures excellent dispersibility and compatibility with resin, metal, or ceramic matrices.  3、High Purity, Low Oxygen Content Purity ≥ 99%, oxygen content ≤ 1%, guaranteeing chemical stability and electrical insulation for high-frequency, high-voltage applications.  4、Low Dielectric Constant & Loss Low dielectric constant (ε ≈ 8.8) and minimal dielectric loss (tanδ < 0.001), ideal for high-frequency circuit packaging.  5、Outstanding Mechanical Properties High hardness and wear resistance enhance the mechanical strength of composites.

30μm Aluminum Nitride (AlN) Ceramic Microspheres are high-performance inorganic non-metallic materials exhibiting outstanding thermal conductivity, electrical insulation, high-temperature resistance, and chemical stability. Their micron-scale spherical structure enables broad application prospects in advanced electronic packaging, composite reinforcement, thermal interface materials, and other fields. Key Features of 30μm Aluminum Nitride (AlN) Ceramic Microspheres: High Thermal Conductivity – With 170-200 W/(m·K) thermal conductivity, AlN microspheres significantly enhance heat dissipation in thermal interface materials (TIMs) and electronic packaging. Excellent Electrical Insulation – Ultra-high resistivity (>10¹⁴ Ω·cm) makes these AlN fillers ideal for high-voltage applications, PCB substrates, and insulating coatings. High-Temperature Resistance – Melting point of 2200°C ensures stability in extreme environments, suitable for aerospace, power electronics, and LED heat sinks. Low CTE (4.5×10⁻⁶/°C) – Matches semiconductor materials (Si, GaN, SiC), reducing thermal stress in chip packaging and power modules. High Purity & Chemical Stability – Corrosion-resistant and acid/alkali-proof, perfect for harsh industrial applications and chemical environments. Uniform Spherical Structure – Narrow particle distribution (D50≈30μm) ensures superior flowability and even dispersion in polymers, composites, and 3D printing materials.