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  • Customize Complex Aluminum Nitride Ceramic Components
    In high-end manufacturing sectors such as electronic information, new energy, and aerospace, the performance limits of materials directly determine the core competitiveness of products. Aluminum nitride (AlN) ceramic components, with their exceptional thermal conductivity, excellent electrical insulation, high strength and temperature resistance, as well as stable chemical properties, have emerged as a new generation of critical structural materials. They replace traditional metals and alumina ceramics, providing core support for the miniaturization, high-power performance, and long-term reliability of precision equipment.   Key Feature Top Thermal Conductivity: With a thermal conductivity of up to 170-230 W/m·K — significantly higher than alumina and plastic — our AlN components efficiently dissipate heat from high-power devices such as LEDs and CPUs, helping to extend product lifespan.   Excellent Electrical Insulation: Volume resistivity ≥10¹⁴ Ω·cm ensures reliable insulation performance, making it ideal for high-voltage applications including power inverters and motor control systems.   Outstanding Durability: Manufactured from high-purity aluminum nitride, our components operate reliably from -200°C to 1000°C and offer strong resistance to thermal shock, corrosion, and mechanical vibration, suitable for demanding automotive and aerospace environments.
  • Aluminum Nitride (ALN) Rings with Various Diameter
    Aluminum Nitride (AlN) ceramic rings are high-performance specialized ceramic components made from high-purity aluminum nitride powder through precision molding and high-temperature sintering processes. With outstanding thermal conductivity, electrical insulation, high-temperature resistance, and low thermal expansion coefficient, AlN ceramic rings are widely used in semiconductor equipment, high-power LEDs, RF/microwave devices, and other fields, making them an indispensable key material in modern industry.   Core Features & Advantages 1、Exceptional Thermal Conductivity Thermal conductivity up to 170-220 W/(m·K), close to that of aluminum and far exceeding alumina ceramics (~30 W/(m·K)), ensuring efficient heat dissipation for high-power devices.  2、Superior Electrical Insulation  Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (8-9), suitable for high-frequency and high-voltage environments, ensuring safe and stable circuit operation.  3、High-Temperature Stability  Withstands temperatures up to 2200°C, maintaining structural stability under extreme thermal cycling conditions and exhibiting excellent thermal shock resistance.  4、Low Thermal Expansion Coefficient  Thermal expansion coefficient (4.5×10⁻⁶/℃–4.9×10⁻⁶/℃) matches silicon (Si) chips, reducing thermal stress and extending device lifespan.  5、Chemical Inertness & Mechanical Strength  Resistant to acid/alkali corrosion and oxidation; high hardness (Mohs 8-9), wear-resistant, and impact-resistant.
  • High purity Aluminum Nitride (AlN) Granule CAS 24304-00-5
    Aluminum nitride granule (ALN granule) is made by spray granulation of Aluminum nitride powder (ALN powder), containing binder and sintering aids, is raw material of high thermal conductivity ceramics,which can be directly pressed and formed.ALN granule of Juci Technology has good fluidity, high sintering activity, high purity and high strength, is used to make various semiconductor equipment parts such as aluminum nitride heater/electrostatic sucker/etching protective cover/hot pressed aluminum nitride ceramics.

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