LED heat dissipation modules AlN

Xiamen Juceri Technology's 120μm Aluminum Nitride (AlN) filler powder is a high-purity, high-thermal-conductivity ceramic powder material, specifically designed for high-performance thermally conductive composites, electronic packaging, thermal interface materials (TIM), and high-thermal-conductivity plastics/rubbers. With its uniform particle size distribution (D50≈120μm) and excellent chemical stability, it significantly enhances the thermal conductivity of matrix materials while maintaining superior electrical insulation and mechanical strength. Key Features: 1、Ultra-High Thermal Conductivity Theoretical thermal conductivity of 170-200 W/(m·K), effectively improving the heat dissipation efficiency of composite materials. 2、Precise Particle Size Control Median particle size (D50) of 120μm with uniform distribution, ensuring easy dispersion and strong compatibility with resin/polymer matrices. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing the impact of impurities on dielectric properties and thermal conductivity. 4、Excellent Insulation Performance Volume resistivity >10¹⁴ Ω·cm, suitable for electronic applications requiring high insulation. 5、Chemical Stability Resistant to high temperatures and corrosion, maintaining stable performance in high-temperature or humid environments. 6、Surface Modifiability Can be treated with silane coupling agents or other surface modifications upon request to enhance interfacial bonding with the matrix.