aluminum nitride powder

In high-end manufacturing sectors such as electronic information, new energy, and aerospace, the performance limits of materials directly determine the core competitiveness of products. Aluminum nitride (AlN) ceramic components, with their exceptional thermal conductivity, excellent electrical insulation, high strength and temperature resistance, as well as stable chemical properties, have emerged as a new generation of critical structural materials. They replace traditional metals and alumina ceramics, providing core support for the miniaturization, high-power performance, and long-term reliability of precision equipment.   Key Feature Top Thermal Conductivity: With a thermal conductivity of up to 170-230 W/m·K — significantly higher than alumina and plastic — our AlN components efficiently dissipate heat from high-power devices such as LEDs and CPUs, helping to extend product lifespan.   Excellent Electrical Insulation: Volume resistivity ≥10¹⁴ Ω·cm ensures reliable insulation performance, making it ideal for high-voltage applications including power inverters and motor control systems.   Outstanding Durability: Manufactured from high-purity aluminum nitride, our components operate reliably from -200°C to 1000°C and offer strong resistance to thermal shock, corrosion, and mechanical vibration, suitable for demanding automotive and aerospace environments.

Aluminum Nitride (AlN) ceramic rings are high-performance specialized ceramic components made from high-purity aluminum nitride powder through precision molding and high-temperature sintering processes. With outstanding thermal conductivity, electrical insulation, high-temperature resistance, and low thermal expansion coefficient, AlN ceramic rings are widely used in semiconductor equipment, high-power LEDs, RF/microwave devices, and other fields, making them an indispensable key material in modern industry.   Core Features & Advantages 1、Exceptional Thermal Conductivity Thermal conductivity up to 170-220 W/(m·K), close to that of aluminum and far exceeding alumina ceramics (~30 W/(m·K)), ensuring efficient heat dissipation for high-power devices.  2、Superior Electrical Insulation  Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (8-9), suitable for high-frequency and high-voltage environments, ensuring safe and stable circuit operation.  3、High-Temperature Stability  Withstands temperatures up to 2200°C, maintaining structural stability under extreme thermal cycling conditions and exhibiting excellent thermal shock resistance.  4、Low Thermal Expansion Coefficient  Thermal expansion coefficient (4.5×10⁻⁶/℃–4.9×10⁻⁶/℃) matches silicon (Si) chips, reducing thermal stress and extending device lifespan.  5、Chemical Inertness & Mechanical Strength  Resistant to acid/alkali corrosion and oxidation; high hardness (Mohs 8-9), wear-resistant, and impact-resistant.

Xiamen Juci Technology Co., Ltd. presents its 150μm high-purity aluminum nitride (AlN) filler powder, a functional ceramic filler designed for high-performance thermally conductive composite materials. With key advantages including ultra-fine particle size (150 microns), high purity (≥99%), and low oxygen content, this product significantly enhances the thermal conductivity of polymer, metal, or ceramic matrix composites. It is widely used in electronic packaging, thermal interface materials (TIMs), high-power LED heat dissipation, and more. Key Features: 1、Exceptional Thermal Conductivity AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), over five times higher than conventional alumina fillers, dramatically improving the overall thermal efficiency of composite materials. 2、Precise Particle Size Distribution D50: 150μm, uniform particle size, smooth surface, and excellent dispersibility ensure efficient thermal conductive network formation in the matrix. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing impurities' impact on dielectric properties and thermal conductivity, making it ideal for high-frequency electronic devices. 4、Superior Electrical Insulation Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (~8.8), suitable for high-insulation-demanding electronic packaging. 5、Strong Chemical Stability High-temperature resistance (stable in air up to 1400°C), corrosion resistance, and excellent compatibility with epoxy resins, silicone gels, and other matrix materials.

30μm Aluminum Nitride (AlN) Ceramic Microspheres are high-performance inorganic non-metallic materials exhibiting outstanding thermal conductivity, electrical insulation, high-temperature resistance, and chemical stability. Their micron-scale spherical structure enables broad application prospects in advanced electronic packaging, composite reinforcement, thermal interface materials, and other fields. Key Features of 30μm Aluminum Nitride (AlN) Ceramic Microspheres: High Thermal Conductivity – With 170-200 W/(m·K) thermal conductivity, AlN microspheres significantly enhance heat dissipation in thermal interface materials (TIMs) and electronic packaging. Excellent Electrical Insulation – Ultra-high resistivity (>10¹⁴ Ω·cm) makes these AlN fillers ideal for high-voltage applications, PCB substrates, and insulating coatings. High-Temperature Resistance – Melting point of 2200°C ensures stability in extreme environments, suitable for aerospace, power electronics, and LED heat sinks. Low CTE (4.5×10⁻⁶/°C) – Matches semiconductor materials (Si, GaN, SiC), reducing thermal stress in chip packaging and power modules. High Purity & Chemical Stability – Corrosion-resistant and acid/alkali-proof, perfect for harsh industrial applications and chemical environments. Uniform Spherical Structure – Narrow particle distribution (D50≈30μm) ensures superior flowability and even dispersion in polymers, composites, and 3D printing materials.

Aluminum Nitride (AlN) thermal filler is a high-performance ceramic material widely used in thermal management applications due to its exceptional properties. Here’s a detailed breakdown of its functional roles: 1. Heat Dissipation (Primary Function) High Thermal Conductivity (~170-200 W/mK) – Efficiently transfers heat away from hotspots in electronic components (e.g., CPUs, power modules, LEDs), making AlN powder ideal for high thermal conductivity fillers. Reduces Thermal Resistance – Improves heat flow in composites (e.g., thermal interface materials (TIMs), epoxy resins), enhancing performance in electronic cooling solutions. 2. Electrical Insulation Dielectric Strength (>15 kV/mm) – Prevents electrical short circuits while conducting heat, critical for high-voltage applications (e.g., power electronics, EV batteries), where AlN ceramic filler ensures reliability. 3. Thermal Expansion Matching CTE (Coefficient of Thermal Expansion) ~4.5 ppm/K – Closely matches silicon and semiconductors, minimizing stress in bonded interfaces (e.g., chip packaging), making AlN single crystal filler a preferred choice for semiconductor thermal management. By incorporating ultra-pure AlN filler or nanoscale AlN powder, manufacturers can optimize thermal conductivity while maintaining electrical insulation, making it a top choice for advanced thermal management  ceramic materials.

Aluminum Nitride thermal filler can be added to resins or plastics to improve their thermal conductivity. It can also be used as a filler in thermal conductive adhesives, thermal grease, and other materials, enhancing the thermal conductivity of composite materials when incorporated into polymer matrices. These composite materials are widely used in electronic products, LED lighting, power supplies, and other fields.

Regarding with aluminum nitride in semiconductor applications, Etching nozzles are components used in semiconductor manufacturing to remove unwanted materials from the surface of wafers. Aluminum nitride ceramic etching nozzles are highly wear-resistant, corrosion-resistant, and highly accurate, and are capable of working stably for long periods of time in high-temperature, high-pressure, and high-corrosive environments, improving etching results and nozzle service life. Unlike other manufacturers' machining methods, we make aluminum nitride etching nozzles by injection molding process, which has the following advantages： 1.Can make complex shapes2.High production quantities3.Excellent performance4.Low cost

Aluminum nitride ceramics, as a high-performance ceramic material with excellent thermal conductivity, electrical insulation and mechanical strength, are widely used in electronics, aerospace, chemical and other fields. In the preparation process of aluminum nitride ceramics, forming technology is one of the key links, which affects the performance and quality of ceramic materials. At present, tape casting, injection molding and compression molding are commonly used molding methods in the preparation of aluminum nitride ceramics.   Ceramic injection molding (CIM) is an emerging technology for manufacturing complex shaped ceramic parts. It uses polymer materials as a carrier, mixes ceramic powder with polymer materials, and then prepares ceramic blanks with complex shapes by injection molding. In the preparation of aluminum nitride ceramics, ceramic injection molding technology has unique advantages. First, it can prepare aluminum nitride ceramic parts with complex shapes and fine structures to meet the needs of special applications. Secondly, the injection molding process can realize continuous and automated production, improving production efficiency and product quality.   The characteristic of Powder injection molding ALN ceramic1.Can make complex shapes2.High production quantities3.Excellent performance4.Low cost

Aluminum nitride is an important inorganic non-metallic material. It not only has the characteristics of ceramic insulation, low expansion, high elastic modulus, etc., but also has the same high thermal conductivity as copper and aluminum (thermal conductivity is 7~10 times that of aluminum oxide). It is a key material in high-end equipment in semiconductor, electric vacuum and other fields, especially in national defense weapon systems, aerospace, electric rail transit, new energy vehicles, high-power LED lighting, communication base stations Aluminum nitride can be used for power devices in power transmission equipment, industrial control equipment and other fields. The aluminum nitride powder of Xiamen Juci Technology has the characteristics of high purity, extremely low metal impurity content, and strong batch stability. Its annual production capacity is 1000t. At present, it has been applied in a large number to tap casting electronic ceramic substrates.

Aluminum nitride granule (ALN granule) is made by spray granulation of Aluminum nitride powder (ALN powder), containing binder and sintering aids, is raw material of high thermal conductivity ceramics,which can be directly pressed and formed.ALN granule of Juci Technology has good fluidity, high sintering activity, high purity and high strength, is used to make various semiconductor equipment parts such as aluminum nitride heater/electrostatic sucker/etching protective cover/hot pressed aluminum nitride ceramics.