AlN ceramic

In the rapidly evolving electronics industry, heat dissipation and reliability are critical determinants of product performance. Aluminum Nitride (AlN) ceramic substrates, with their exceptional thermal conductivity, excellent electrical insulation properties, and stable mechanical characteristics, are becoming the ideal choice for high-power and high-frequency electronic devices. Whether in 5G communications, new energy vehicles, aerospace, industrial lasers, or semiconductor lighting, AlN ceramic substrates provide unmatched solutions, helping your products stand out in the competitive landscape.   Key Feature Superior Thermal Conductivity: With a thermal conductivity of 170-220 W/(m·K), far exceeding that of alumina ceramics, AlN efficiently dissipates heat, ensuring stable operation of high-power electronic components.   Excellent Electrical Insulation: High resistivity and low dielectric loss make it suitable for high-frequency circuits, reducing signal transmission loss and enhancing device performance.   Outstanding Thermal Expansion Matching: Its thermal expansion coefficient is similar to that of semiconductor materials like silicon and gallium arsenide, effectively reducing thermal stress and extending device lifespan.   Mechanical Strength and Stability: High strength, hardness, and resistance to chemical corrosion ensure reliability and durability even in harsh environments.   Precision Machining Capability: Supports processes like laser cutting, drilling, and metallization, meeting complex circuit design requirements and enabling high-integration packaging.

Our Aluminum Nitride (AlN) Injection-Molded Custom Ceramic Parts combine advanced injection molding technology with high-purity AlN ceramic materials. Designed for complex, irregular shapes, this product breaks the limitations of traditional ceramic processing, enabling precise manufacturing of components with tight tolerances  and intricate geometries—ideal for industries requiring both performance and design flexibility.   Key Feature Superior Thermal Conductivity: ≥170 W/(m·K) thermal conductivity, 5-10x higher than alumina ceramics, ensuring efficient heat dissipation for high-power electronics.​   Excellent Electrical Insulation: Volume resistivity ≥10¹⁴ Ω·cm, protecting sensitive circuits while transferring heat.​   Customizable Shapes: Injection molding supports one-step production of complex structures (e.g., grooves, holes, curved surfaces) without secondary processing, reducing costs by 30% vs. traditional machining.​   High Mechanical Strength: Flexural strength ≥300 MPa, ensuring durability in harsh environments (temperature range: -200℃ to 800℃).​   Low Thermal Expansion: Coefficient of thermal expansion (CTE) matching silicon (≈4.5×10⁻⁶/℃), minimizing thermal stress in electronic assemblies.  

In the field of high-temperature applications, the requirements for material performance are becoming increasingly stringent. Our mini aluminum nitride ceramic crucible, with its exceptional performance, has become an ideal choice for numerous industries. 1、Ultra-High Thermal Conductivity: The mini aluminum nitride ceramic crucible boasts an ultra-high thermal conductivity, ensuring efficient heat transfer. Whether for non-ferrous metal smelting or semiconductor material synthesis, it can distribute heat quickly and evenly, greatly improving process efficiency while reducing energy consumption and supporting sustainable industrial operations. 2、Excellent Thermal Stability: It can withstand extreme high temperatures. As a high-temperature refractory crucible, it still operates stably in harsh environments where other materials are incompetent, ensuring long-term reliable performance, reducing downtime, and improving production efficiency. 3、Superior Chemical Resistance: It has excellent resistance to corrosion, does not react with non-ferrous metals such as copper, aluminum, and silver, and can also resist the dissolution of aluminum, iron, and aluminum alloys. In semiconductor applications, its stability against molten salts like gallium arsenide is particularly crucial, which can prevent silicon contamination and ensure the production of high-purity semiconductor materials.  

Aluminum Nitride Ceramic Parts offer exceptional thermal conductivity, electrical insulation, and mechanical strength, making them ideal for high-tech industries. Whether you need reliable components for electronics, semiconductor, LED, or aerospace applications, our precision-engineered AlN ceramic parts deliver unmatched performance. Key Features & Benefits: Excellent Thermal Conductivity (170-210 W/mK) – Efficient heat dissipation for high-power devices. High Electrical Insulation – Perfect for electronic substrates and insulators. Superior Mechanical Strength – Resistant to wear, corrosion, and thermal shock. Low Thermal Expansion – Ensures stability in extreme temperature environments. Customizable Designs – Precision-machined to meet your exact specifications.

Looking for top-quality aluminum nitride ceramic tubes? Our products stand out in the market with exceptional properties, making them ideal for diverse industrial applications.​ Key Advantages Superior Thermal Conductivity: With a thermal conductivity of 170-210 W/(m·K), these tubes excel in heat dissipation, perfect for high-power electronic devices.​ Excellent Electrical Insulation: Boasting a volume resistivity of >10¹⁴ Ω·cm at room temperature, they ensure safe operation in high-voltage environments.​ High Strength & Corrosion Resistance: Bending resistance 300-400 MPa and resistance to high temperatures (over 1000℃) and chemicals, suitable for harsh working conditions.​

Aluminum Nitride (AlN) ceramic square sheets are precision-engineered ceramic materials manufactured from high-purity AlN powder through advanced sintering technology. Renowned for their exceptional thermal conductivity, electrical insulation, and thermo-mechanical properties, AlN ceramic sheets are widely used in high-power electronics, LED packaging, semiconductor devices, RF/microwave components, and more, making them a critical material in modern electronics   Core Features & Advantages Ultra-high thermal conductivity (180-220 W/m·K) - 5-10x better than alumina for efficient heat dissipation Excellent electrical insulation (10¹⁴ Ω·cm) - ideal for high-voltage applications Proven reliability in power electronics (IGBTs, power modules) and optoelectronics (LEDs, laser diodes) Critical solution for EV power systems and rail converters requiring both thermal management and electrical isolation  

Aluminum Nitride (AlN) ceramic rings are high-performance specialized ceramic components made from high-purity aluminum nitride powder through precision molding and high-temperature sintering processes. With outstanding thermal conductivity, electrical insulation, high-temperature resistance, and low thermal expansion coefficient, AlN ceramic rings are widely used in semiconductor equipment, high-power LEDs, RF/microwave devices, and other fields, making them an indispensable key material in modern industry.   Core Features & Advantages 1、Exceptional Thermal Conductivity Thermal conductivity up to 170-220 W/(m·K), close to that of aluminum and far exceeding alumina ceramics (~30 W/(m·K)), ensuring efficient heat dissipation for high-power devices.  2、Superior Electrical Insulation  Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (8-9), suitable for high-frequency and high-voltage environments, ensuring safe and stable circuit operation.  3、High-Temperature Stability  Withstands temperatures up to 2200°C, maintaining structural stability under extreme thermal cycling conditions and exhibiting excellent thermal shock resistance.  4、Low Thermal Expansion Coefficient  Thermal expansion coefficient (4.5×10⁻⁶/℃–4.9×10⁻⁶/℃) matches silicon (Si) chips, reducing thermal stress and extending device lifespan.  5、Chemical Inertness & Mechanical Strength  Resistant to acid/alkali corrosion and oxidation; high hardness (Mohs 8-9), wear-resistant, and impact-resistant.

Our aluminum nitride (AlN) ceramic balls excel in high thermal conductivity, low thermal expansion, excellent electrical insulation, and outstanding mechanical strength, making them ideal for demanding industrial applications. Manufactured using high-purity materials and advanced sintering technology, our AlN ceramic balls ensure high density and low porosity for superior performance in extreme conditions.   Why Choose Our AlN Ceramic Balls? Ultra-High Thermal Conductivity (170-200 W/m·K) – Ideal for efficient heat dissipation Low Thermal Expansion– Ensures stability in high-temperature environments High Strength & Wear Resistance – Extended service life Excellent Electrical Insulation – Perfect for electronics and semiconductor applications Corrosion & Oxidation Resistant – Suitable for harsh conditions in chemical and aerospace industries  

Xiamen Juci Technology Co., Ltd. presents its 150μm high-purity aluminum nitride (AlN) filler powder, a functional ceramic filler designed for high-performance thermally conductive composite materials. With key advantages including ultra-fine particle size (150 microns), high purity (≥99%), and low oxygen content, this product significantly enhances the thermal conductivity of polymer, metal, or ceramic matrix composites. It is widely used in electronic packaging, thermal interface materials (TIMs), high-power LED heat dissipation, and more. Key Features: 1、Exceptional Thermal Conductivity AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), over five times higher than conventional alumina fillers, dramatically improving the overall thermal efficiency of composite materials. 2、Precise Particle Size Distribution D50: 150μm, uniform particle size, smooth surface, and excellent dispersibility ensure efficient thermal conductive network formation in the matrix. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing impurities' impact on dielectric properties and thermal conductivity, making it ideal for high-frequency electronic devices. 4、Superior Electrical Insulation Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (~8.8), suitable for high-insulation-demanding electronic packaging. 5、Strong Chemical Stability High-temperature resistance (stable in air up to 1400°C), corrosion resistance, and excellent compatibility with epoxy resins, silicone gels, and other matrix materials.

Aluminum Nitride (AlN) thermal filler is a high-performance ceramic material widely used in thermal management applications due to its exceptional properties. Here’s a detailed breakdown of its functional roles: 1. Heat Dissipation (Primary Function) High Thermal Conductivity (~170-200 W/mK) – Efficiently transfers heat away from hotspots in electronic components (e.g., CPUs, power modules, LEDs), making AlN powder ideal for high thermal conductivity fillers. Reduces Thermal Resistance – Improves heat flow in composites (e.g., thermal interface materials (TIMs), epoxy resins), enhancing performance in electronic cooling solutions. 2. Electrical Insulation Dielectric Strength (>15 kV/mm) – Prevents electrical short circuits while conducting heat, critical for high-voltage applications (e.g., power electronics, EV batteries), where AlN ceramic filler ensures reliability. 3. Thermal Expansion Matching CTE (Coefficient of Thermal Expansion) ~4.5 ppm/K – Closely matches silicon and semiconductors, minimizing stress in bonded interfaces (e.g., chip packaging), making AlN single crystal filler a preferred choice for semiconductor thermal management. By incorporating ultra-pure AlN filler or nanoscale AlN powder, manufacturers can optimize thermal conductivity while maintaining electrical insulation, making it a top choice for advanced thermal management  ceramic materials.

Aluminum Nitride heat sinks are ideal for heat dissipation in high-performance electronic devices due to their excellent thermal conductivity and insulating properties. Made of aluminum nitride (AlN), the heatsink can effectively conduct heat to ensure the stable operation of electronic components. Its high thermal conductivity of 170 -210W/m-K significantly improves heat dissipation efficiency, while its excellent electrical insulation performance supports high voltage applications. Whether used in new energy vehicles, power electronics or high-power LED lighting, Aluminum Nitride heat sinks provide excellent thermal management solutions to ensure the reliability and durability of devices in high-temperature environments.        

Aluminum nitride heat sinks are high thermal conductivity materials with high strength, high hardness, excellent wear resistance, and good corrosion resistance. Its thermal conductivity is extremely high, approximately five times that of aluminum and three times that of copper, making it one of the highest thermal conductive materials currently available. Additionally, aluminum nitride heat sinks possess very high strength, allowing them to withstand significant pressure and tensile forces without deforming or damaging easily. They also exhibit good corrosion and wear resistance, enabling them to operate stably in harsh environments for extended periods. Aluminum nitride heat sinks are widely used in various fields such as electronics, LED lighting, automotive electronics, and aerospace for heat dissipation and thermal management, particularly in high-power electronic devices. Due to their unique physical and chemical properties, they can quickly dissipate generated heat, maintaining a stable operating temperature for equipment while also extending its lifespan.