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In the rapidly evolving electronics industry, heat dissipation and reliability are critical determinants of product performance. Aluminum Nitride (AlN) ceramic substrates, with their exceptional thermal conductivity, excellent electrical insulation properties, and stable mechanical characteristics, are becoming the ideal choice for high-power and high-frequency electronic devices. Whether in 5G communications, new energy vehicles, aerospace, industrial lasers, or semiconductor lighting, AlN ceramic substrates provide unmatched solutions, helping your products stand out in the competitive landscape.   Key Feature Superior Thermal Conductivity: With a thermal conductivity of 170-220 W/(m·K), far exceeding that of alumina ceramics, AlN efficiently dissipates heat, ensuring stable operation of high-power electronic components.   Excellent Electrical Insulation: High resistivity and low dielectric loss make it suitable for high-frequency circuits, reducing signal transmission loss and enhancing device performance.   Outstanding Thermal Expansion Matching: Its thermal expansion coefficient is similar to that of semiconductor materials like silicon and gallium arsenide, effectively reducing thermal stress and extending device lifespan.   Mechanical Strength and Stability: High strength, hardness, and resistance to chemical corrosion ensure reliability and durability even in harsh environments.   Precision Machining Capability: Supports processes like laser cutting, drilling, and metallization, meeting complex circuit design requirements and enabling high-integration packaging.

Our Aluminum Nitride (AlN) Injection-Molded Custom Ceramic Parts combine advanced injection molding technology with high-purity AlN ceramic materials. Designed for complex, irregular shapes, this product breaks the limitations of traditional ceramic processing, enabling precise manufacturing of components with tight tolerances  and intricate geometries—ideal for industries requiring both performance and design flexibility.   Key Feature Superior Thermal Conductivity: ≥170 W/(m·K) thermal conductivity, 5-10x higher than alumina ceramics, ensuring efficient heat dissipation for high-power electronics.​   Excellent Electrical Insulation: Volume resistivity ≥10¹⁴ Ω·cm, protecting sensitive circuits while transferring heat.​   Customizable Shapes: Injection molding supports one-step production of complex structures (e.g., grooves, holes, curved surfaces) without secondary processing, reducing costs by 30% vs. traditional machining.​   High Mechanical Strength: Flexural strength ≥300 MPa, ensuring durability in harsh environments (temperature range: -200℃ to 800℃).​   Low Thermal Expansion: Coefficient of thermal expansion (CTE) matching silicon (≈4.5×10⁻⁶/℃), minimizing thermal stress in electronic assemblies.  

In the field of high-temperature applications, the requirements for material performance are becoming increasingly stringent. Our mini aluminum nitride ceramic crucible, with its exceptional performance, has become an ideal choice for numerous industries. 1、Ultra-High Thermal Conductivity: The mini aluminum nitride ceramic crucible boasts an ultra-high thermal conductivity, ensuring efficient heat transfer. Whether for non-ferrous metal smelting or semiconductor material synthesis, it can distribute heat quickly and evenly, greatly improving process efficiency while reducing energy consumption and supporting sustainable industrial operations. 2、Excellent Thermal Stability: It can withstand extreme high temperatures. As a high-temperature refractory crucible, it still operates stably in harsh environments where other materials are incompetent, ensuring long-term reliable performance, reducing downtime, and improving production efficiency. 3、Superior Chemical Resistance: It has excellent resistance to corrosion, does not react with non-ferrous metals such as copper, aluminum, and silver, and can also resist the dissolution of aluminum, iron, and aluminum alloys. In semiconductor applications, its stability against molten salts like gallium arsenide is particularly crucial, which can prevent silicon contamination and ensure the production of high-purity semiconductor materials.  

Aluminum Nitride Ceramic Parts offer exceptional thermal conductivity, electrical insulation, and mechanical strength, making them ideal for high-tech industries. Whether you need reliable components for electronics, semiconductor, LED, or aerospace applications, our precision-engineered AlN ceramic parts deliver unmatched performance. Key Features & Benefits: Excellent Thermal Conductivity (170-210 W/mK) – Efficient heat dissipation for high-power devices. High Electrical Insulation – Perfect for electronic substrates and insulators. Superior Mechanical Strength – Resistant to wear, corrosion, and thermal shock. Low Thermal Expansion – Ensures stability in extreme temperature environments. Customizable Designs – Precision-machined to meet your exact specifications.

Looking for top-quality aluminum nitride ceramic tubes? Our products stand out in the market with exceptional properties, making them ideal for diverse industrial applications.​ Key Advantages Superior Thermal Conductivity: With a thermal conductivity of 170-210 W/(m·K), these tubes excel in heat dissipation, perfect for high-power electronic devices.​ Excellent Electrical Insulation: Boasting a volume resistivity of >10¹⁴ Ω·cm at room temperature, they ensure safe operation in high-voltage environments.​ High Strength & Corrosion Resistance: Bending resistance 300-400 MPa and resistance to high temperatures (over 1000℃) and chemicals, suitable for harsh working conditions.​

Aluminum nitride (AlN) crucibles, due to their unique material properties, have extensive application value in high-temperature and special environments. Provide extremely stable solutions for semiconductor, crystal growth and high-temperature experiments   Key Features  ①Withstands Extreme Temperatures (Up to 2200°C) – Stable in inert atmospheres, far outperforming conventional ceramic crucibles  ②Exceptional Thermal Conductivity (170 W/m·K) – Ensures uniform heating, minimizes thermal stress, and enhances crystal growth quality  ③Zero Carbon Contamination – Graphite-free, preventing impurity doping in metal melting or semiconductor processing  ④Superior Corrosion Resistance – Resists molten metals (Al/Cu/Ga) and aggressive salts

Aluminum Nitride (AlN) ceramic square sheets are precision-engineered ceramic materials manufactured from high-purity AlN powder through advanced sintering technology. Renowned for their exceptional thermal conductivity, electrical insulation, and thermo-mechanical properties, AlN ceramic sheets are widely used in high-power electronics, LED packaging, semiconductor devices, RF/microwave components, and more, making them a critical material in modern electronics   Core Features & Advantages Ultra-high thermal conductivity (180-220 W/m·K) - 5-10x better than alumina for efficient heat dissipation Excellent electrical insulation (10¹⁴ Ω·cm) - ideal for high-voltage applications Proven reliability in power electronics (IGBTs, power modules) and optoelectronics (LEDs, laser diodes) Critical solution for EV power systems and rail converters requiring both thermal management and electrical isolation  

Aluminum Nitride (AlN) ceramic rings are high-performance specialized ceramic components made from high-purity aluminum nitride powder through precision molding and high-temperature sintering processes. With outstanding thermal conductivity, electrical insulation, high-temperature resistance, and low thermal expansion coefficient, AlN ceramic rings are widely used in semiconductor equipment, high-power LEDs, RF/microwave devices, and other fields, making them an indispensable key material in modern industry.   Core Features & Advantages 1、Exceptional Thermal Conductivity Thermal conductivity up to 170-220 W/(m·K), close to that of aluminum and far exceeding alumina ceramics (~30 W/(m·K)), ensuring efficient heat dissipation for high-power devices.  2、Superior Electrical Insulation  Volume resistivity >10¹⁴ Ω·cm, low dielectric constant (8-9), suitable for high-frequency and high-voltage environments, ensuring safe and stable circuit operation.  3、High-Temperature Stability  Withstands temperatures up to 2200°C, maintaining structural stability under extreme thermal cycling conditions and exhibiting excellent thermal shock resistance.  4、Low Thermal Expansion Coefficient  Thermal expansion coefficient (4.5×10⁻⁶/℃–4.9×10⁻⁶/℃) matches silicon (Si) chips, reducing thermal stress and extending device lifespan.  5、Chemical Inertness & Mechanical Strength  Resistant to acid/alkali corrosion and oxidation; high hardness (Mohs 8-9), wear-resistant, and impact-resistant.

Our aluminum nitride (AlN) ceramic balls excel in high thermal conductivity, low thermal expansion, excellent electrical insulation, and outstanding mechanical strength, making them ideal for demanding industrial applications. Manufactured using high-purity materials and advanced sintering technology, our AlN ceramic balls ensure high density and low porosity for superior performance in extreme conditions.   Why Choose Our AlN Ceramic Balls? Ultra-High Thermal Conductivity (170-200 W/m·K) – Ideal for efficient heat dissipation Low Thermal Expansion– Ensures stability in high-temperature environments High Strength & Wear Resistance – Extended service life Excellent Electrical Insulation – Perfect for electronics and semiconductor applications Corrosion & Oxidation Resistant – Suitable for harsh conditions in chemical and aerospace industries  

Xiamen Juci Technology Co., Ltd. introduces high thermal conductivity aluminum nitride (AlN) gap filler powder (120μm), a high thermal conductivity interface material designed for advanced thermal applications. With exceptional thermal conductivity (theoretical value: 170-200 W/m·K), low dielectric constant, and outstanding insulation properties, this product is an ideal choice for electronic packaging, composite materials, thermal interface materials, and more. The precisely controlled 120μm particle size ensures excellent dispersibility and packing density, significantly enhancing the thermal management efficiency of matrix materials. Key Features: 1、Ultra-High Thermal Conductivity: Dramatically improves the thermal performance of ceramic and polymer composites, ensuring stable operation of electronic devices by efficiently dissipating heat. Forms an effective thermal network for rapid heat transfer, reducing operating temperatures. 2、 Low Oxygen Content & High Crystallinity: Low oxygen content enhances intrinsic thermal conductivity, while high crystallinity ensures stable and reliable performance even in harsh environments. 3、Narrow Particle Size Distribution & Excellent Flowability: Precisely controlled 120μm particle size with uniform isometric morphology ensures easy dispersion during production and consistent end-product performance, minimizing defect rates. 4、 Superior Hydrolysis Resistance: Surface-modified for excellent moisture resistance, ensuring long-term storage stability without performance degradation.

Xiamen Juci Technology Co., Ltd. introduces its high thermal conductivity series 100μm polycrystalline aluminum nitride (AlN) filler powder, a high-purity ceramic filler designed for advanced thermal management composites. Utilizing cutting-edge synthesis and classification technology, this product delivers exceptional thermal conductivity, excellent chemical stability, and optimized particle size distribution. It significantly enhances the heat dissipation performance of polymers, adhesives, and ceramic matrices, making it ideal for applications in electronic packaging, LED cooling, 5G communication devices, and high-power modules. Key Features: 1、Ultra-High Thermal Conductivity Polycrystalline AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), effectively addressing high heat flux dissipation challenges in electronic components. Low coefficient of thermal expansion (≈4.6×10⁻⁶/K), matching semiconductor materials to minimize interfacial stress. 2、Precise Particle Size Control D50 ≈ 100μm, with uniform particle distribution, optimizing packing density to form efficient thermal pathways. Customizable surface treatments (e.g., silane coupling agent modification) to improve compatibility with resins and metals. 3、High Purity & Reliability Purity ≥ 99%, oxygen content < 1%, ensuring minimal impact on dielectric properties. High-temperature resistance (>1800°C) and corrosion resistance, suitable for harsh environments. 4、Versatile Applications Thermal Adhesives/Pastes: Increases thermal conductivity when filled. Ceramic Matrix Composites: Used for high-thermal-conductivity insulating substrates or packaging materials. Thermal Interface Materials (TIMs): Reduces contact thermal resistance in electronic assemblies.

The 80μm Aluminum Nitride (AlN) Filler, developed by Xiamen Juci Technology, is a high-performance ceramic material designed for electronic packaging, thermal interface materials (TIMs), and high-thermal-conductivity composites. Featuring a precisely controlled particle size distribution (D50≈80μm), ultra-high purity (≥99%), and exceptional thermal conductivity (170-200 W/(m·K)), it significantly enhances the thermal management efficiency of polymer, metal, or ceramic matrices. It is ideal for demanding heat dissipation applications in 5G communications, new energy vehicles, power electronics, and more. Key Features: 1、Exceptional Thermal Conductivity Theoretical thermal conductivity of 170–200 W/(m·K), effectively addressing thermal management challenges in electronic devices.  2、Precise Particle Size Control Uniform distribution with an average particle size (D50) of 80μm ensures excellent dispersibility and compatibility with resin, metal, or ceramic matrices.  3、High Purity, Low Oxygen Content Purity ≥ 99%, oxygen content ≤ 1%, guaranteeing chemical stability and electrical insulation for high-frequency, high-voltage applications.  4、Low Dielectric Constant & Loss Low dielectric constant (ε ≈ 8.8) and minimal dielectric loss (tanδ < 0.001), ideal for high-frequency circuit packaging.  5、Outstanding Mechanical Properties High hardness and wear resistance enhance the mechanical strength of composites.