thermal interface materials

Xiamen Juci Technology Co., Ltd. introduces high thermal conductivity aluminum nitride (AlN) gap filler powder (120μm), a high thermal conductivity interface material designed for advanced thermal applications. With exceptional thermal conductivity (theoretical value: 170-200 W/m·K), low dielectric constant, and outstanding insulation properties, this product is an ideal choice for electronic packaging, composite materials, thermal interface materials, and more. The precisely controlled 120μm particle size ensures excellent dispersibility and packing density, significantly enhancing the thermal management efficiency of matrix materials. Key Features: 1、Ultra-High Thermal Conductivity: Dramatically improves the thermal performance of ceramic and polymer composites, ensuring stable operation of electronic devices by efficiently dissipating heat. Forms an effective thermal network for rapid heat transfer, reducing operating temperatures. 2、 Low Oxygen Content & High Crystallinity: Low oxygen content enhances intrinsic thermal conductivity, while high crystallinity ensures stable and reliable performance even in harsh environments. 3、Narrow Particle Size Distribution & Excellent Flowability: Precisely controlled 120μm particle size with uniform isometric morphology ensures easy dispersion during production and consistent end-product performance, minimizing defect rates. 4、 Superior Hydrolysis Resistance: Surface-modified for excellent moisture resistance, ensuring long-term storage stability without performance degradation.

Xiamen Juci Technology Co., Ltd. introduces its high thermal conductivity series 100μm polycrystalline aluminum nitride (AlN) filler powder, a high-purity ceramic filler designed for advanced thermal management composites. Utilizing cutting-edge synthesis and classification technology, this product delivers exceptional thermal conductivity, excellent chemical stability, and optimized particle size distribution. It significantly enhances the heat dissipation performance of polymers, adhesives, and ceramic matrices, making it ideal for applications in electronic packaging, LED cooling, 5G communication devices, and high-power modules. Key Features: 1、Ultra-High Thermal Conductivity Polycrystalline AlN boasts a theoretical thermal conductivity of 170-200 W/(m·K), effectively addressing high heat flux dissipation challenges in electronic components. Low coefficient of thermal expansion (≈4.6×10⁻⁶/K), matching semiconductor materials to minimize interfacial stress. 2、Precise Particle Size Control D50 ≈ 100μm, with uniform particle distribution, optimizing packing density to form efficient thermal pathways. Customizable surface treatments (e.g., silane coupling agent modification) to improve compatibility with resins and metals. 3、High Purity & Reliability Purity ≥ 99%, oxygen content < 1%, ensuring minimal impact on dielectric properties. High-temperature resistance (>1800°C) and corrosion resistance, suitable for harsh environments. 4、Versatile Applications Thermal Adhesives/Pastes: Increases thermal conductivity when filled. Ceramic Matrix Composites: Used for high-thermal-conductivity insulating substrates or packaging materials. Thermal Interface Materials (TIMs): Reduces contact thermal resistance in electronic assemblies.

The 80μm Aluminum Nitride (AlN) Filler, developed by Xiamen Juci Technology, is a high-performance ceramic material designed for electronic packaging, thermal interface materials (TIMs), and high-thermal-conductivity composites. Featuring a precisely controlled particle size distribution (D50≈80μm), ultra-high purity (≥99%), and exceptional thermal conductivity (170-200 W/(m·K)), it significantly enhances the thermal management efficiency of polymer, metal, or ceramic matrices. It is ideal for demanding heat dissipation applications in 5G communications, new energy vehicles, power electronics, and more. Key Features: 1、Exceptional Thermal Conductivity Theoretical thermal conductivity of 170–200 W/(m·K), effectively addressing thermal management challenges in electronic devices.  2、Precise Particle Size Control Uniform distribution with an average particle size (D50) of 80μm ensures excellent dispersibility and compatibility with resin, metal, or ceramic matrices.  3、High Purity, Low Oxygen Content Purity ≥ 99%, oxygen content ≤ 1%, guaranteeing chemical stability and electrical insulation for high-frequency, high-voltage applications.  4、Low Dielectric Constant & Loss Low dielectric constant (ε ≈ 8.8) and minimal dielectric loss (tanδ < 0.001), ideal for high-frequency circuit packaging.  5、Outstanding Mechanical Properties High hardness and wear resistance enhance the mechanical strength of composites.

Xiamen Juceri Technology's 120μm Aluminum Nitride (AlN) filler powder is a high-purity, high-thermal-conductivity ceramic powder material, specifically designed for high-performance thermally conductive composites, electronic packaging, thermal interface materials (TIM), and high-thermal-conductivity plastics/rubbers. With its uniform particle size distribution (D50≈120μm) and excellent chemical stability, it significantly enhances the thermal conductivity of matrix materials while maintaining superior electrical insulation and mechanical strength. Key Features: 1、Ultra-High Thermal Conductivity Theoretical thermal conductivity of 170-200 W/(m·K), effectively improving the heat dissipation efficiency of composite materials. 2、Precise Particle Size Control Median particle size (D50) of 120μm with uniform distribution, ensuring easy dispersion and strong compatibility with resin/polymer matrices. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, minimizing the impact of impurities on dielectric properties and thermal conductivity. 4、Excellent Insulation Performance Volume resistivity >10¹⁴ Ω·cm, suitable for electronic applications requiring high insulation. 5、Chemical Stability Resistant to high temperatures and corrosion, maintaining stable performance in high-temperature or humid environments. 6、Surface Modifiability Can be treated with silane coupling agents or other surface modifications upon request to enhance interfacial bonding with the matrix.

30μm Aluminum Nitride (AlN) Ceramic Microspheres are high-performance inorganic non-metallic materials exhibiting outstanding thermal conductivity, electrical insulation, high-temperature resistance, and chemical stability. Their micron-scale spherical structure enables broad application prospects in advanced electronic packaging, composite reinforcement, thermal interface materials, and other fields. Key Features of 30μm Aluminum Nitride (AlN) Ceramic Microspheres: High Thermal Conductivity – With 170-200 W/(m·K) thermal conductivity, AlN microspheres significantly enhance heat dissipation in thermal interface materials (TIMs) and electronic packaging. Excellent Electrical Insulation – Ultra-high resistivity (>10¹⁴ Ω·cm) makes these AlN fillers ideal for high-voltage applications, PCB substrates, and insulating coatings. High-Temperature Resistance – Melting point of 2200°C ensures stability in extreme environments, suitable for aerospace, power electronics, and LED heat sinks. Low CTE (4.5×10⁻⁶/°C) – Matches semiconductor materials (Si, GaN, SiC), reducing thermal stress in chip packaging and power modules. High Purity & Chemical Stability – Corrosion-resistant and acid/alkali-proof, perfect for harsh industrial applications and chemical environments. Uniform Spherical Structure – Narrow particle distribution (D50≈30μm) ensures superior flowability and even dispersion in polymers, composites, and 3D printing materials.

Aluminum Nitride (AlN) thermal filler is a high-performance ceramic material widely used in thermal management applications due to its exceptional properties. Here’s a detailed breakdown of its functional roles: 1. Heat Dissipation (Primary Function) High Thermal Conductivity (~170-200 W/mK) – Efficiently transfers heat away from hotspots in electronic components (e.g., CPUs, power modules, LEDs), making AlN powder ideal for high thermal conductivity fillers. Reduces Thermal Resistance – Improves heat flow in composites (e.g., thermal interface materials (TIMs), epoxy resins), enhancing performance in electronic cooling solutions. 2. Electrical Insulation Dielectric Strength (>15 kV/mm) – Prevents electrical short circuits while conducting heat, critical for high-voltage applications (e.g., power electronics, EV batteries), where AlN ceramic filler ensures reliability. 3. Thermal Expansion Matching CTE (Coefficient of Thermal Expansion) ~4.5 ppm/K – Closely matches silicon and semiconductors, minimizing stress in bonded interfaces (e.g., chip packaging), making AlN single crystal filler a preferred choice for semiconductor thermal management. By incorporating ultra-pure AlN filler or nanoscale AlN powder, manufacturers can optimize thermal conductivity while maintaining electrical insulation, making it a top choice for advanced thermal management  ceramic materials.